Abstract
The strength analysis of the joints between several thin copper strands bundled together was carried out. Both multi-strand
and single-stranded jointed cables, by soldering or ultrasonic welding, were experienced experimentally using T-peel tests.
In addition, a parametric study aimed to elucidate the effect of the cross-sectional area of the welded cables and the speed of
the T-peel test on the strength of the welded area was established. It was found that the strength of the filaments increased
with an increasing cross-sectional area of the ropes. The speed of movement of the T-peel test affected the breaking strength
as a function of the cross-section. It was also observed that the displacement speed of the T-peel test significantly affected the
tensile strength as a function of the cross-section. For deformation analyses, 2D Digital Image Correlation (DIC) was applied
to the surface of the specimens. Furthermore, the visualization of the images acquired by the DIGICAM optical microscope
of the welded or soldered specimens before and after the T-peel test allowed the observation of the main fracture modes,
namely: the tearing of the filaments, the deterioration of the welded zones, and the resistance of the last filaments to fracture.